Empack Utrecht 2018

  • Fagron Arseus Capelle aan den IJssel Bolidtop 500



STAND NO.  1.C104

 Empack is a trade fair where packaging experts come together to gain advice and discover innovations in the areas of food, machinery, recycling and material choices. This year’s central statement is: ‘’Innovation is not surrealism, but reality’’. With this quote Empack refers to the fact that developments within the packaging industry do not stand still and follow each other in rapid succession.

Empack is the only packaging show in the Benelux which offers a gleam into the future of packaging. Bolidt will present its flooring systems that meet all requirements in this industry due to their unique concepts in composition, optics and functionality.


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Bolidt Synthetic Products & Systems

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Mailing address

P.O. Box 131
3340 AC Hendrik-Ido-Ambacht
The Netherlands

Visitor address

Bolidt Innovation Center
Noordeinde 2
3341 LW The Netherlands

TEL +31 (0)78 684 54 44
EMAIL website@bolidt.nl